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DS402ST
DS402ST
Rectifier Diode
Replaces March 1998 version, DS4183-2.3 DS4183-3.0 January 2000
APPLICATIONS
s Rectification s Freewheel Diode s DC Motor Control s Power Supplies s Welding s Battery Chargers
KEY PARAMETERS VRRM 1400V IF(AV) 505A IFSM 5600A
FEATURES
s Double Side Cooling s High Surge Capability
VOLTAGE RATINGS
Type Number Repetitive Peak Reverse Voltage VRRM V Conditions
DS402ST14 1400 DS402ST13 1300 DS402ST12 1200 DS402ST11 1100 DS402ST10 1000 DS402ST09 900 Lower voltage grades available.
VRSM = VRRM + 100V
Outline type code: T. See Package Details for further information.
CURRENT RATINGS
Symbol Double Side Cooled IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load, Tcase = 100oC Tcase = 100oC Tcase = 100oC 505 793 640 A A A Parameter Conditions Max. Units
Single Side Cooled (Anode side) IF(AV) IF(RMS) IF Mean forward current RMS value Continuous (direct) forward current Half wave resistive load, Tcase = 100oC Tcase = 100oC Tcase = 100oC 365 573 390 A A A 1/7
DS402ST
SURGE RATINGS
Symbol IFSM I2t IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current I2t for fusing Conditions 10ms half sine; Tcase = 175oC VR = 50% VRRM - 1/4 sine 10ms half sine; Tcase = 175oC VR = 0 Max. 4.5 101 x 103 5.6 155 x 103 Units kA A2s kA A2s
THERMAL AND MECHANICAL DATA
Symbol Parameter Conditions Double side cooled Rth(j-c) Thermal resistance - junction to case Single side cooled Cathode dc Clamping force 4.5kN with mounting compound On-state (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Clamping force -55 3.5 175 200 5.0
o
Min. dc Anode dc -
Max. 0.08 0.16 0.16 0.02 0.04 185
Units
o
C/W
o
C/W C/W C/W C/W
o
o
Double side Single side
o
Rth(c-h)
Thermal resistance - case to heatsink
o
C
C C
o
kN
CHARACTERISTICS
Symbol VFM IRRM VTO rT Parameter Forward voltage Peak reverse current Threshold voltage Slope resistance Conditions At 450A peak, Tcase = 25oC At VRRM, Tcase = 175oC At Tvj = 175C At Tvj = 175C Min. Max. 1.25 15 0.81 0.84 Units V mA V m
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DS402ST
CURVES
2000 Measured under pulse conditions
Instantaneous forward current IF - (A)
1500
Tj = 25C Tj = 175C
1000
500
0 0.50
1.00 1.50 2.00 Instantaneous forward voltage VF - (V)
Fig. 1 Maximum (limit) forward characteristics
2.50
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DS402ST
1200
dc Half wave
1000
3 phase 800
Mean power dissipation - (W)
6 phase 600
400
200
0
0
200
400 600 Mean forward current IF(AV) - (A) FIG 2 DISSIPATION CURVES
Fig. 2 Dissipation curves
800
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DS402ST
12
Peak half sine forward current - (kA)
I2t = I2 x t 2 10 100
8
90
I2t value - (A2s x 103)
6
2
80
4
It
70
2
60
0 1 ms
10
1
235
10 20
50 50
Cycles at 50Hz Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 50% VRRM, Tcase = 175C)
1.0
Conduction Effective thermal resistance Junction to case C/W Double side Single side d.c. 0.08 0.16 Halfwave 0.09 0.17 3 phase 120 0.12 0.20 6 phase 60 -
Anode side cooled
Thermal impedance - (C/W)
0.1
Double side cooled
0.01
0.001 0.001
0.01
0.1 Time - (s)
1
10
Fig. 4 Transient thermal impedance - junction to case - (C/W)
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DS402ST
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
2 holes O3.6 x 2.0 deep (One in each electrode)
Cathode O42 max O19 nom
15.0 14.0
O19 nom O37.5 max
Anode
Nominal weight: 50g Clamping force: 4.5kN 10% Package outine type code: T
ASSOCIATED PUBLICATIONS
Title Calculating the junction temperature or power semiconductors Recommendations for clamping power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic
TO T
Application Note Number AN4506 AN4839 AN4853 AN5001
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DS402ST
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4183-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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